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CY8C20134, CY8C20234, CY8C20334 CY8C20434, CY8C20534, CY8C20634
PSoC(R) Programmable System-on-ChipTM
PSoC(R) Programmable System-on-ChipTM
Features
Low power CapSense(R) block Configurable capacitive sensing elements Supports combination of CapSense buttons, sliders, touchpads, and proximity sensors Powerful Harvard-architecture processor M8C processor speeds running up to 12 MHz Low power at high speed Operating voltage: 2.4 V to 5.25 V Industrial temperature range: -40 C to +85 C Flexible on-chip memory 8 KB flash program storage 50,000 erase/write cycles 512-Bytes SRAM data storage Partial flash updates Flexible protection modes Interrupt controller In-system serial programming (ISSP) Complete development tools Free development tool (PSoC DesignerTM) Full-featured, in-circuit emulator, and programmer Full-speed emulation Complex breakpoint structure 128 KB trace memory Precision, programmable clocking Internal 5.0% 6- / 12-MHz main oscillator Internal low speed oscillator at 32 kHz for watchdog and sleep Programmable pin configurations Pull-up, high Z, open-drain, and CMOS drive modes on all GPIOs Up to 28 analog inputs on all GPIOs Configurable inputs on all GPIOs 20-mA sink current on all GPIOs Selectable, regulated digital I/O on port 1 * 3.0 V, 20 mA total port 1 source current * 5 mA strong drive mode on port 1 versatile analog mux Common internal analog bus Simultaneous connection of I/O combinations Comparator noise immunity Low-dropout voltage regulator for the analog array
Additional system resources Configurable communication speeds * I2C: selectable to 50 kHz, 100 kHz, or 400 kHz * SPI: configurable between 46.9 kHz and 3 MHz 2 I C slave SPI master and SPI slave Watchdog and sleep timers Internal voltage reference Integrated supervisory circuit
Logic Block Diagram
Port 3 Port 2 Port 1 Port 0 Config LDO
PSoC CORE
System Bus
Global Analog Interconnect SRAM 512 Bytes Interrupt Controller SROM Flash 8K Sleep and Watchdog
CPU Core (M8C)
6/12 MHz Internal Main Oscillator
ANALOG SYSTEM
CapSense Block
Analog Ref.
I2C Slave/SPI Master-Slave
POR and LVD System Resets
Analog Mux
SYSTEM RESOURCES
Cypress Semiconductor Corporation Document Number: 001-05356 Rev. *N
*
198 Champion Court
*
San Jose, CA 95134-1709 * 408-943-2600 Revised February 16, 2011
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Contents
PSoC(R) Programmable System-on-ChipTM ..................... 1 Features ............................................................................. 1 Logic Block Diagram ........................................................ 1 PSoC Functional Overview .............................................. 3 PSoC Core .................................................................. 3 CapSense Analog System .......................................... 3 Additional System Resources ..................................... 3 PSoC Device Characteristics ...................................... 4 Getting Started .................................................................. 4 Application Notes ........................................................ 4 Development Kits ........................................................ 4 Training ....................................................................... 4 Cypros Consultants ..................................................... 4 Solutions Library .......................................................... 4 Technical Support ....................................................... 4 Development Tools .......................................................... 5 PSoC Designer Software Subsystems ........................ 5 In-Circuit Emulator ....................................................... 5 Designing with PSoC Designer ....................................... 6 Select Components ..................................................... 6 Configure Components ............................................... 6 Organize and Connect ................................................ 6 Generate, Verify, and Debug ....................................... 6 Pin Information ................................................................. 7 8-Pin SOIC Pinout ....................................................... 7 16-Pin SOIC Pinout ..................................................... 8 48-Pin OCD Part Pinout .............................................. 9 16-Pin Part Pinout ..................................................... 11 24-Pin Part Pinout ..................................................... 12 32-Pin Part Pinout ..................................................... 13 28-Pin Part Pinout ..................................................... 15 30-Ball Part Pinout .................................................... 16 Electrical Specifications ................................................ 17 Absolute Maximum Ratings ....................................... 17 Operating Temperature ............................................. 18 DC Electrical Characteristics ..................................... 18 AC Electrical Characteristics ........................................ 23 Packaging Dimensions .................................................. 30 Thermal Impedances ................................................. 35 Solder Reflow Peak Temperature ............................. 35 Development Tool Selection ......................................... 36 Software .................................................................... 36 Development Kits ...................................................... 36 Evaluation Tools ............................................................. 36 Device Programmers ................................................. 37 Accessories (Emulation and Programming) .............. 37 Ordering Information ...................................................... 38 Ordering Code Definitions ............................................. 38 Acronyms ........................................................................ 39 Acronyms Used ......................................................... 39 Reference Documents .................................................... 39 Document Conventions ................................................. 40 Units of Measure ....................................................... 40 Numeric Conventions ................................................ 40 Glossary .......................................................................... 40 Document History Page ................................................. 45 Sales, Solutions, and Legal Information ...................... 47 Worldwide Sales and Design Support ....................... 47 Products .................................................................... 47 PSoC Solutions ......................................................... 47
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PSoC Functional Overview
The PSoC family consists of many Programmable System-on-Chips with On-Chip Controller devices. These devices are designed to replace multiple traditional MCU based system components with one low cost single chip programmable component. A PSoC device includes configurable analog and digital blocks and programmable interconnect. This architecture enables the user to create customized peripheral configurations to match the requirements of each individual application. Additionally, a fast CPU, flash program memory, SRAM data memory, and configurable I/O are included in a range of convenient pinouts. The PSoC architecture for this device family, as shown in Figure 1, consists of three main areas: the Core, the System Resources, and the CapSense Analog System. A common versatile bus enables connection between I/O and the analog system. Each CY8C20x34 PSoC device includes a dedicated CapSense block that provides sensing and scanning control circuitry for capacitive sensing applications. Depending on the PSoC package, up to 28 general purpose I/O (GPIO) are also included. The GPIO provide access to the MCU and analog mux. Figure 1. Analog System Block Diagram
ID AC
Analog Global Bus
Vr R eferenc e Buffer
C internal
C om parator
Mux Mux
PSoC Core
The PSoC Core is a powerful engine that supports a rich instruction set. It encompasses SRAM for data storage, an interrupt controller, sleep and watchdog timers, IMO , and ILO. The CPU core, called the M8C, is a powerful processor with speeds up to 12 MHz. The M8C is a two MIPS, 8-bit Harvard-architecture microprocessor. System Resources provide additional capability such as a configurable I2C slave or SPI master-slave communication interface and various system resets supported by the M8C. The Analog System consists of the CapSense PSoC block and an internal 1.8 V analog reference. Together they support capacitive sensing of up to 28 inputs.
R efs
C ap Sens e C ounters
C SC LK IMO C apSens e C lock Selec t R elaxation O s c illator (RO)
CapSense Analog System
The Analog System contains the capacitive sensing hardware. Several hardware algorithms are supported. This hardware performs capacitive sensing and scanning without requiring external components. Capacitive sensing is configurable on each GPIO pin. Scanning of enabled CapSense pins is completed quickly and easily across multiple ports.
Analog Multiplexer System The Analog Mux Bus connects to every GPIO pin. Pins are connected to the bus individually or in any combination. The bus also connects to the analog system for analysis with the CapSense block comparator. Switch control logic enables selected pins to precharge continuously under hardware control. This enables capacitive measurement for applications such as touch sensing. Other multiplexer applications include:

Complex capacitive sensing interfaces such as sliders and touch pads Chip-wide mux that enables analog input from any I/O pin Crosspoint connection between any I/O pin combinations
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Additional System Resources
System Resources provide additional capability useful to complete systems. Additional resources include low voltage detection and power on reset. Brief statements describing the merits of each system resource follow:

Low voltage detection (LVD) interrupts signal the application of falling voltage levels, while the advanced POR (Power On Reset) circuit eliminates the need for a system supervisor. An internal 1.8 V reference provides an absolute reference for capacitive sensing. The 5 V maximum input, 3 V fixed output, low dropout regulator (LDO) provides regulation for I/Os. A register controlled bypass mode enables the user to disable the LDO.
The I2C slave or SPI master-slave module provides 50/100/400 kHz communication over two wires. SPI communication over three or four wires run at speeds of 46.9 kHz to 3 MHz (lower for a slower system clock).

PSoC Device Characteristics
Depending on your PSoC device characteristics, the digital and analog systems can have 16, 8, or 4 digital blocks, and 12, 6, or 4 analog blocks. Table 1 lists the resources available for specific PSoC device groups. The PSoC device covered by this datasheet is highlighted. Table 1. PSoC Device Characteristics
PSoC Part Number CY8C29x66 CY8C28xxx CY8C27x43 CY8C24x94 CY8C24x23A CY8C23x33 CY8C22x45 CY8C21x45 CY8C21x34 CY8C21x23 CY8C20x34 CY8C20xx6 Digital I/O up to 64 up to 44 up to 44 up to 56 up to 24 up to 26 up to 38 up to 24 up to 28 up to 16 up to 28 up to 36 Digital Rows 4 up to 3 2 1 1 1 2 1 1 1 0 0 Digital Blocks 16 up to 12 8 4 4 4 8 4 4 4 0 0 Analog Inputs up to 12 up to 44 up to 12 up to 48 up to 12 up to 12 up to 38 up to 24 up to 28 up to 8 up to 28 up to 36 Analog Outputs 4 up to 4 4 2 2 2 0 0 0 0 0 0 Analog Columns 4 up to 6 4 2 2 2 4 4 2 2 0 0 Analog Blocks 12 up to 12 + 4[1] 12 6 6 4 6[1] 6[1] 4
[1]
SRAM Size 2K 1K 256 1K 256 256 1K 512 512 256 512 up to 2K
Flash Size 32 K 16 K 16 K 16 K 4K 8K 16 K 8K 8K 4K 8K up to 32 K
4[1] 3[1,2] 3[1,2]
Getting Started
The quickest way to understand PSoC silicon is to read this datasheet and then use the PSoC Designer Integrated Development Environment (IDE). This datasheet is an overview of the PSoC integrated circuit and presents specific pin, register, and electrical specifications. For in depth information, along with detailed programming information, see the Technical Reference Manual for this PSoC device. For up-to-date ordering, packaging, and electrical specification information, see the latest PSoC device datasheets on the web at http://www.cypress.com.
Development Kits
PSoC Development Kits are available online from Cypress at http://www.cypress.com and through a growing number of regional and global distributors, which include Arrow, Avnet, Digi-Key, Farnell, Future Electronics, and Newark.
Training
Free PSoC technical training (on demand, webinars, and workshops) is available online at http://www.cypress.com. The training covers a wide variety of topics and skill levels to assist you in your designs.
Application Notes
Application notes are an excellent introduction to the wide variety of possible PSoC designs and are available at http://www.cypress.com.
Notes 1. Limited analog functionality 2. Two analog blocks and one CapSense(R).
Cypros Consultants
Certified PSoC Consultants offer everything from technical assistance to completed PSoC designs. To contact or become a PSoC Consultant, go to http://www.cypress.com and refer to CYPros Consultants.
Document Number: 001-05356 Rev. *N
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Solutions Library
Visit our growing library of solution focused designs at http://www.cypress.com. Here you can find various application designs that include firmware and hardware design files that enable you to complete your designs quickly.
Technical Support
For assistance with technical issues, search KnowledgeBase articles and forums at http://www.cypress.com. If you cannot find an answer to your question, call technical support at 1-800-541-4736.
Development Tools
PSoC Designer is a Microsoft(R) Windows-based, integrated development environment for the Programmable System-on-Chip (PSoC) devices. The PSoC Designer IDE runs on Windows XP or Windows Vista. This system provides design database management by project, an integrated debugger with In-Circuit Emulator, in-system programming support, and built-in support for third-party assemblers and C compilers. PSoC Designer also supports C language compilers developed specifically for the devices in the PSoC family. Code Generation Tools PSoC Designer supports multiple third party C compilers and assemblers. The code generation tools work seamlessly within the PSoC Designer interface and have been tested with a full range of debugging tools. The choice is yours. Assemblers. The assemblers enable assembly code to merge seamlessly with C code. Link libraries automatically use absolute addressing or are compiled in relative mode, and linked with other software modules to get absolute addressing. C Language Compilers. C language compilers are available that support the PSoC family of devices. The products enable you to create complete C programs for the PSoC family devices. The optimizing C compilers provide all the features of C tailored to the PSoC architecture. They come complete with embedded libraries providing port and bus operations, standard keypad and display support, and extended math functionality. Debugger The PSoC Designer Debugger subsystem provides hardware in-circuit emulation, allowing you to test the program in a physical system while providing an internal view of the PSoC device. Debugger commands enable the designer to read and program and read and write data memory, read and write I/O registers, read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The debugger also enables the designer to create a trace buffer of registers and memory locations of interest. Online Help System The online help system displays online, context-sensitive help for the user. Designed for procedural and quick reference, each functional subsystem has its own context-sensitive help. This system also provides tutorials and links to FAQs and an Online Support Forum to aid the designer in getting started.
PSoC Designer Software Subsystems
System-Level View A drag-and-drop visual embedded system design environment based on PSoC Express. In the system level view you create a model of your system inputs, outputs, and communication interfaces. You define when and how an output device changes state based upon any or all other system devices. Based upon the design, PSoC Designer automatically selects one or more PSoC Mixed-Signal Controllers that match your system requirements. PSoC Designer generates all embedded code, then compiles and links it into a programming file for a specific PSoC device. Chip-Level View The chip-level view is a more traditional integrated development environment (IDE). Choose a base device to work with and then select different onboard analog and digital components called user modules that use the PSoC blocks. Examples of user modules are ADCs, DACs, Amplifiers, and Filters. Configure the user modules for your chosen application and connect them to each other and to the proper pins. Then generate your project. This prepopulates your project with APIs and libraries that you can use to program your application. The device editor also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic configuration enables changing configurations at run time. Hybrid Designs You can begin in the system-level view, allow it to choose and configure your user modules, routing, and generate code, then switch to the chip-level view to gain complete control over on-chip resources. All views of the project share a common code editor, builder, and common debug, emulation, and programming tools.
In-Circuit Emulator
A low cost, high functionality In-Circuit Emulator (ICE) is available for development support. This hardware has the capability to program single devices. The emulator consists of a base unit that connects to the PC by way of a USB port. The base unit is universal and operates with all PSoC devices. Emulation pods for each device family are available separately. The emulation pod takes the place of the PSoC device in the target board and performs full-speed (24 MHz) operation.
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Designing with PSoC Designer
The development process for the PSoC device differs from that of a traditional fixed function microprocessor. The configurable analog and digital hardware blocks give the PSoC architecture a unique flexibility that pays dividends in managing specification change during development and by lowering inventory costs. These configurable resources, called PSoC Blocks, have the ability to implement a wide variety of user-selectable functions. The PSoC development process can be summarized in the following four steps: 1. Select components 2. Configure components 3. Organize and Connect 4. Generate, Verify, and Debug
Organize and Connect
You can build signal chains at the chip level by interconnecting user modules to each other and the I/O pins, or connect system level inputs, outputs, and communication interfaces to each other with valuator functions. In the system-level view, selecting a potentiometer driver to control a variable speed fan driver and setting up the valuators to control the fan speed based on input from the pot selects, places, routes, and configures a programmable gain amplifier (PGA) to buffer the input from the potentiometer, an analog to digital converter (ADC) to convert the potentiometer's output to a digital signal, and a PWM to control the fan. In the chip-level view, perform the selection, configuration, and routing so that you have complete control over the use of all on-chip resources.
Select Components
Both the system-level and chip-level views provide a library of prebuilt, pretested hardware peripheral components. In the system-level view, these components are called "drivers" and correspond to inputs (a thermistor, for example), outputs (a brushless DC fan, for example), communication interfaces (I2C-bus, for example), and the logic to control how they interact with one another (called valuators). In the chip-level view, the components are called "user modules". User modules make selecting and implementing peripheral devices simple, and come in analog, digital, and mixed signal varieties.
Generate, Verify, and Debug
When you are ready to test the hardware configuration or move on to developing code for the project, perform the "Generate Application" step. This causes PSoC Designer to generate source code that automatically configures the device to your specification and provides the software for the system. Both system-level and chip-level designs generate software based on your design. The chip-level design provides application programming interfaces (APIs) with high level functions to control and respond to hardware events at run-time and interrupt service routines that you can adapt as needed. The system-level design also generates a C main() program that completely controls the chosen application and contains placeholders for custom code at strategic positions allowing you to further refine the software without disrupting the generated code. A complete code development environment allows you to develop and customize your applications in C, assembly language, or both. The last step in the development process takes place inside PSoC Designer's Debugger subsystem. The Debugger downloads the HEX image to the ICE where it runs at full speed. Debugger capabilities rival those of systems costing many times more. In addition to traditional single-step, run-to-breakpoint and watch-variable features, the Debugger provides a large trace buffer and allows you define complex breakpoint events that include monitoring address and data bus values, memory locations and external signals.
Configure Components
Each of the components you select establishes the basic register settings that implement the selected function. They also provide parameters and properties that enable you to tailor their precise configuration to your particular application. For example, a PWM User Module configures one or more digital PSoC blocks, one for each 8 bits of resolution. The user module parameters permit you to establish the pulse width and duty cycle. Configure the parameters and properties to correspond to your chosen application. Enter values directly or by selecting values from drop-down menus. Both the system-level drivers and chip-level user modules are documented in datasheets that are viewed directly in PSoC Designer. These datasheets explain the internal operation of the component and provide performance specifications. Each datasheet describes the use of each user module parameter or driver property, and other information you may need to successfully implement your design.
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Pin Information
This section describes, lists, and illustrates the CY8C20234, CY8C20334, CY8C20434, CY8C20534, and CY8C20634 PSoC device pins and pinout configurations. The CY8C20x34 PSoC device is available in a variety of packages that are listed and shown in the following tables. Every port pin (labeled with a "P") is capable of Digital I/O and connection to the common analog bus. However, VSS, VDD, and XRES are not capable of Digital I/O.
8-Pin SOIC Pinout
Figure 2. CY8C20134-12SXI 8-Pin SOIC Pinout
VSS A, I, P0[5] AI, P0[1] A, I, P0[3] AI, I2C SCL, P1[7] I2C SCL, P1[1] AI, I2C SDA, P1[5] Vss
1 8 2 7 SOIC6 3 5 4
VDD Vdd P2[2],AI A, P0[4],
I
P1[0], I2C SDA, DATA *, AI P0[2], A, I P1[1], I2C SCL, CLK*, AI P1[0], I2CSDA
Table 2. Pin Definitions - CY8C20134 8-Pin (SOIC) Pin No. 1 2 3 4 5 6 7 I/O I/O I/O I/O I/O I/O Digital Power I I I I I I Analog VSS P0[1] P1[7] P1[5] P1[1] P1[0] P2[2] Name Ground connection Analog column mux input, integrating input I2C serial clock(SCL) I2C serial data (SDA) I2C serial clock(SCL), ISSP-SCLK I2C serial data (SDA), ISSP-SDATA Analog column mux input Supply voltage Description
8 Power VDD A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive.
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16-Pin SOIC Pinout
Figure 3. CY8C20234-12SXI 16-Pin SOIC Pinout
AI, P0[7] A, I, P0[7] AI,P0[3] A, I, P0[5] AI,P0[1] A, I, P0[3] A, I, P0[1] AI,P2[5] AI,P2[1] SMP AI, I2C SCL, SPI SS, P1[7] Vss AI, I2C SDA, SPI I2CSCL,P1[5] MISO, P1[1] AI, SPI CLK, P1[3] Vss
1 2 3 4 5 6 7 8
SOIC
16 15 14 13 12 11 10 9
VDD Vdd P0[4],AI P0[6], A, I P0[4], A, I XRES P0[2], A, I P1[4],EXTCLK,AI P1[2],AI P0[0], A, I P1[0],I2C SDA, P1[4],EXTCLK DATA*, AI P1[2] Vss P1[0], I2CSDA P1[1],I2C SCL, SPI MOSI, CLK*,AL
Table 3. Pin Definitions - CY8C20234 16-Pin (SOIC) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 I/O I/O I/O I/O I/O I/O I/O I/O I/O Power I/O I/O I/O I/O I/O Power I I I I I Digital I I I I I I I I I Analog Name P0[7] P0[3] P0[1] P2[5] P2[1] P1[7] P1[5] P1[3] P1[1] VSS P1[0] P1[2] P1[4] XRES P0[4] VDD Analog column mux input Analog column mux input and column input, integrating input Analog column mux input, integrating input Analog column mux input Analog column mux input I2C serial clock(SCL),SPI SS I2C serial data (SDA),SPI MISO Analog column mux input,SPI CLK I2C serial clock(SCL), ISSP-SCLK,SPI MOSI Ground connection I2C serial data (SDA), ISSP-SDATA Analog column mux input Analog column mux input ,optional external clock input(EXTCLK) XRES Analog column mux input Supply voltage Description
A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive.
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48-Pin OCD Part Pinout
The 48-Pin QFN part table and pin diagram is for the CY8C20000 On-Chip Debug (OCD) PSoC device. This part is only used for in-circuit debugging. It is NOT available for production. Figure 4. CY8C20000 48-Pin OCD PSoC Device
NC Vss P0[3], AI P0[5], AI P0[7], AI P0[6], AI NC 39 OCDO Vdd OCDE NC 38 NC 37 36 35 34 33 32 31 30 29 28 27 26 25 P0[4], P0[2], P0[0], P2[6], P2[4], P2[2],
48 47
46
45 44
43
13 14
15 16
17
18 19
20 21
CCLK
AI, CLK*, I2C SCL, SPI MOSI, P1[1] Vss
HCLK
AI, DATA*, I2C SDA, P1[0]
AI, SPI CLK, P1[3]
AI, P1[2]
NC NC
NC
Table 4. Pin Definitions - CY8C20000 48-Pin OCD (QFN) [4] Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 IOH IOH Power I I I/O I/O I/O I/O I/O I/O I/O IOH IOH I/O I I I I I I I I I I Digital Analog NC P0[1] P2[7] P2[5] P2[3] P2[1] P3[3] P3[1] P1[7] P1[5] P0[1] NC NC NC NC P1[3] P1[1] VSS CCLK HCLK No connection No Connection No Connection SPI CLK CLK[3], I2C SCL, SPI MOSI Ground connection OCD CPU clock output OCD high speed clock output DATA[3], I2C SDA I2C SCL, SPI SS I2C SDA, SPI MISO Name No connection Description
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NC NC
22 23 24
NC AI, P0[1] AI, P2[7] AI, P2[5] AI, P2[3] AI, P2[1] AI, P3[3] AI, P3[1] AI, I2C SCL, SPI SS, P1[7] AI, I2C SDA, SPI MISO, P1[5] NC NC
42 41 40
1 2
3 4 5 6 7 8 9 10 11 12
OCD QFN
AI AI AI AI AI AI
P2[0], AI P3[2], AI P3[0], AI XRES P1[6], AI P1[4], EXTCLK, AI
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Table 4. Pin Definitions - CY8C20000 48-Pin OCD (QFN) [4] Pin No. 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 CP Power I/O I/O I/O Power I I I I/O Power I IOH IOH Input I/O I/O I/O I/O I/O I/O I/O I/O I I I I I I I I I I IOH IOH Digital I I Analog Name P1[0] P1[2] NC NC NC P1[4] P1[6] XRES P3[0] P3[2] P2[0] P2[2] P2[4] P2[6] P0[0] P0[2] NC NC NC P0[6] VDD OCDO OCDE P0[7] P0[5] P0[3] VSS NC VSS Integrating Input Ground connection No connection Center pad is connected to ground No connection No connection No connection Analog bypass Supply voltage OCD odd data output OCD even data I/O Active high external reset with internal pull-down No connection No connection No connection Optional external clock input (EXTCLK) Description
A = Analog, I = Input, O = Output, NC = No Connection H = 5 mA High Output Drive.
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16-Pin Part Pinout
Figure 5. CY8C20234 16-Pin PSoC Device
P0[1], AI AI, P2[5] AI, P2[1] AI, I2C SCL, SPI SS, P1[7] AI, I2C SDA, SPI MISO, P1[5] 1 2 3 4 P0[3], AI P0[7], AI VDD 14 13 8 12 9 P0[4], AI XRES P1[4], AI, EXTCLK P1[2], AI CLK, I2C SCL, SPI MOSI P1[1] VSS AI, DATA, I2C SDA, P1[0]
Table 5. Pin Definitions - CY8C20234 16-Pin (QFN no e-pad) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Type Digital I/O I/O IOH IOH IOH IOH Power IOH IOH IOH Input I/O Power I/O I/O I/O I I I I I I I I I I I I I Analog Name P2[5] P2[1] P1[7] P1[5] P1[3] P1[1] VSS P1[0] P1[2] P1[4] XRES P0[4] VDD P0[7] P0[3] P0[1] Integrating Input Supply voltage Optional external clock input (EXTCLK) Active high external reset with internal pull-down I2C SCL, SPI SS I2C SDA, SPI MISO SPI CLK CLK[3], I2C SCL, SPI MOSI Ground connection DATA[3], I2C SDA Description
A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive
Note 3. These are the ISSP pins, that are not High Z at POR (Power-on-Reset). See the PSoC Technical Reference Manual for details.
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AI, SPI CLK, P1[3]
5 6 7
16 15
QFN 11 (Top View)10
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24-Pin Part Pinout
Figure 6. CY8C20334 24-Pin PSoC Device
P0[1], AI AI, P2[5] AI, P2[3] AI, P2[1] AI, I2C SCL, SPI SS, P1[7] AI, I2C SDA, SPI MISO, P1[5] AI, SPI CLK, P1[3] P0[3], AI P0[5], AI P0[7], AI VDD P0[6], AI 18 17 16 15 14 13 P0[4], AI P0[2], AI P0[0], AI P2[0], AI XRES P1[6], AI
Table 6. Pin Definitions - CY8C20334 24-Pin (QFN) [4] Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 CP Type Digital Analog I/O I I/O I I/O I IOH I IOH IOH IOH Power IOH IOH IOH IOH Input I/O I/O I/O I/O I/O Power I/O I/O I/O I/O Power I I I Name P2[5] P2[3] P2[1] P1[7] P1[5] P1[3] P1[1] NC VSS P1[0] P1[2] P1[4] P1[6] XRES P2[0] P0[0] P0[2] P0[4] P0[6] VDD P0[7] P0[5] P0[3] P0[1] VSS Description
I2C SCL, SPI SS I2C SDA, SPI MISO SPI CLK CLK[3], I2C SCL, SPI MOSI No Connection Ground Connection DATA[3], I2C SDA Optional external clock input (EXTCLK) Active high external reset with internal pull-down
I I I I I I I I I I I I I
Analog bypass Supply voltage
Integrating input Center pad is connected to ground
A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive
Document Number: 001-05356 Rev. *N
AI, CLK*, I2C SCL SPI MOSI, P1[1] NC VSS AI, DATA*, I2C SDA, P1[0] AI, P1[2] AI, EXTCLK, P1[4]
7 8 9 10 11 12
1 2 QFN 3 4 (Top View) 5 6
24 23 22 21 20 19
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32-Pin Part Pinout
Figure 7. CY8C20434 32-Pin PSoC Device
Vss P0[3], AI P0[5], AI P0[7], AI Vdd P0[6], AI P0[4], AI P0[2], AI AI, P0[1] AI, P2[7] AI, P2[5] AI, P2[3] AI, P2[1] AI, P3[3] AI, P3[1] SPI SS, P1[7]
AI, I2C SCL
1 2 3 4 5 6 7 8
32 31 30 29 28 27 26 25
QFN
(Top View)
Table 7. Pin Definitions - CY8C20434 32-Pin (QFN) [4] Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 Digital I/O I/O I/O I/O I/O I/O I/O IOH IOH IOH IOH Power IOH IOH IOH IOH Input I/O I/O Type Analog I I I I I I I I I I I I I I I I I Name P0[1] P2[7] P2[5] P2[3] P2[1] P3[3] P3[1] P1[7] P1[5] P1[3] P1[1] VSS P1[0] P1[2] P1[4] P1[6] XRES P3[0] P3[2] Description
I2C SCL, SPI SS I2C SDA, SPI MISO SPI CLK CLK[3], I2C SCL, SPI MOSI Ground Connection DATA[3], I2C SDA Optional external clock input (EXTCLK) Active high external reset with internal pull-down
Note 4. The center pad on the QFN package is connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground, it is electrically floated and not connected to any other signal.
Document Number: 001-05356 Rev. *N
AI, I2C SDA, SPI MISO, P1[5] AI, SPI CLK, P1[3] AI, CLK*, I2C SCL, SPI MOSI, P1[1] Vss AI, DATA*, I2C SDA, P1[0] AI, P1[2] AI, EXTCLK, P1[4] AI, P1[6]
9 10 11 12 13 14 15 16
24 23 22 21 20 19 18 17
P0[0], AI P2[6], AI P2[4], AI P2[2], AI P2[0], AI P3[2], AI P3[0], AI XRES
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Table 7. Pin Definitions - CY8C20434 32-Pin (QFN) [4] Type Name Description Digital Analog 20 I/O I P2[0] 21 I/O I P2[2] 22 I/O I P2[4] 23 I/O I P2[6] 24 I/O I P0[0] 25 I/O I P0[2] 26 I/O I P0[4] 27 I/O I P0[6] Analog bypass 28 Power VDD Supply voltage 29 I/O I P0[7] 30 I/O I P0[5] 31 I/O I P0[3] Integrating input 32 Power VSS Ground connection CP Power VSS Center pad is connected to ground A = Analog, I = Input, O = Output, OH = 5 mA high output drive. Pin No.
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28-Pin Part Pinout
Figure 8. CY8C20534 28-Pin PSoC Device
AI P0[7] AI P0[5] AI P0[3] AI P0[1] AI P2[7] AI P2[5] AI P2[3] AI P2[1] Vss AI, I2C SCL P1[7] AI, I2C SDA P1[5] AI P1[3] AI, I2C SCL P1[1] Vss
1 2 3 4 5 6 7 8 9 10 11 12 13 14
SSOP
28 27 26 25 24 23 22 21 20 19 18 17 16 15
Vdd P0[6] AI P0[4] AI P0[2] AI P0[0] AI P2[6] AI P2[4] AI P2[2] AI P2[0] AI XRES P1[6] AI P1[4] EXTCLK, AI P1[2] AI P1[0] I2C SDA, AI
Table 8. Pin Definitions - CY8C20534 28-Pin (SSOP) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Digital I/O I/O I/O I/O I/O I/O I/O I/O Power I/O I/O I/O I/O Power I/O I/O I/O I/O Input I/O I/O I/O I/O I/O I/O I/O I/O Power Type Analog I I I I I I I I I I I I I I I I I I I I I I I I Name P0[7] P0[5] P0[3] P0[1] P2[7] P2[5] P2[3] P2[1] VSS P1[7] P1[5] P1[3] P1[1] VSS P1[0] P1[2] P1[4] P1[6] XRES P2[0] P2[2] P2[4] P2[6] P0[0] P0[2] P0[4] P0[6] VDD Description Analog column mux input Analog column mux input and column output Analog column mux input and column output, integrating input Analog column mux input, integrating input
Direct switched capacitor block input Direct switched capacitor block input Ground connection I2C serial clock (SCL) I2C serial data (SDA) I2C serial clock (SCL), ISSP-SCLK[3] Ground connection I2C serial data (SDA), ISSP-SDATA[3] Optional external clock input (EXTCLK) Active high external reset with internal pull-down Direct switched capacitor block input Direct switched capacitor block input
Analog column mux input Analog column mux input Analog column mux input Analog column mux input Supply voltage
A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive.
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30-Ball Part Pinout
Figure 9. CY8C20634 30-Ball PSoC Device
5 4 3 2 1 A B C D E F
Table 9. 30-Ball Part Pinout (WLCSP) Pin No. A1 A2 A3 A4 A5 B1 B2 B3 B4 B5 C1 C2 C3 C4 C5 D1 D2 D3 D4 D5 E1 E2 E3 E4 E5 F1 F2 F3 F4 F5 Digital Power I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O IOH I/O Input IOH IOH IOH I/O Power IOH IOH IOH IOH Type Analog I I I I I I I I I I I I I I I I I I I I I I I I I I I Name VDD P0[6] P0[4] P0[3] P2[7] P0[2] P0[0] P2[6] P0[5] P0[1] P2[4] P2[2] P3[1] P0[7] P2[1] P2[0] P3[0] P3[2] P1[1] P2[3] XRES P1[6] P1[4] P1[5] P2[5] VSS P1[2] P1[0] P1[3] P1[7] Supply voltage Analog bypass Integrating input Description
CLK[3], I2C SCL, SPI MOSI Active high external reset with internal pull-down Optional external clock input (EXTCLK) I2C SDA, SPI MISO Ground connection DATA[3], I2C SDA SPI CLK I2C SCL, SPI SS
A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive.
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Electrical Specifications
This section presents the DC and AC electrical specifications of the CY8C20234, CY8C20334, CY8C20434, CY8C20534, and CY8C20634 PSoC devices. For the latest electrical specifications, check the most recent datasheet by visiting the web at http://www.cypress.com. Specifications are valid for -40 C TA 85 C and TJ 100 C as specified, except where mentioned. Refer to Table 19 on page 23 for the electrical specifications on the internal main oscillator (IMO) using SLIMO mode. Figure 10. Voltage versus CPU Frequency and IMO Frequency Trim Options
5.25 5.25
SLIMO SLIMO SLIMO Mode=1 Mode=1 Mode=0
4.75 Vdd Voltage 4.75 Vdd Voltage
O
lid ng Va rati n pe gio Re
3.60
3.00 2.70 2.40 750 kHz 3 MHz 6 MHz 12 MHz
3.00 2.70 2.40 750 kHz 3 MHz
SLIMO SLIMO Mode=1 Mode=0 SLIMO Mode=1
SLIMO Mode=0
6 MHz
12 MHz
CPU Frequency
IMO Frequency
Absolute Maximum Ratings
Table 10. Absolute Maximum Ratings
Symbol TSTG Description Storage Temperature Min -55 Typ 25 Max +100 Units C Notes Higher storage temperatures reduces data retention time. Recommended storage temperature is +25 C 25 C. Extended duration storage temperatures above 65 C degrades reliability.
TBAKETEMP tBAKETIME TA VDD VIO VIOZ IMIO ESD LU
Bake temperature Bake time Ambient temperature with power applied Supply voltage on VDD relative to VSS DC input voltage DC voltage applied to tri-state Maximum current into any port pin Electro static discharge voltage Latch-up current
- See package label -40 -0.5 VSS - 0.5 VSS - 0.5 -25 2000 -
125 - - - - - - - -
See package label 72 +85 +6.0 VDD + 0.5 VDD + 0.5 +50 - 200
C Hours C V V V mA V mA
Human body model ESD.
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Operating Temperature
Table 11. Operating Temperature
Symbol TA TJ Description Ambient temperature Junction temperature Min -40 -40 Typ - - Max +85 +100 Units C C Notes The temperature rise from ambient to junction is package specific. See Table 16 on page 21. The user must limit the power consumption to comply with this requirement.
DC Electrical Characteristics
DC Chip Level Specifications Table 12 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and -40 C TA 85 C, 3.0V to 3.6V and -40 C TA 85 C, or 2.4 V to 3.0 V and -40 C TA 85 C, respectively. Typical parameters apply to 5 V, 3.3 V, or 2.7 V at 25 C. These are for design guidance only. Table 12. DC Chip Level Specifications
Symbol VDD IDD12 IDD6 ISB27 ISB Description Supply voltage Supply current, IMO = 12 MHz Supply current, IMO = 6 MHz Sleep (mode) current with POR, LVD, Sleep timer, WDT, and internal slow oscillator active. Mid temperature range. Sleep (mode) current with POR, LVD, Sleep timer, WDT, and internal slow oscillator active. Min 2.40 - - - - Typ - 1.5 1 2.6 2.8 Max 5.25 2.5 1.5 4 5 Units V mA mA A A Notes See Table 16 on page 21. Conditions are VDD = 3.0 V, TA = 25 C, CPU = 12 MHz. Conditions are VDD = 3.0 V, TA = 25 C, CPU = 6 MHz VDD = 2.55 V, 0 C TA 40 C VDD = 3.3 V, -40 C TA 85 C
DC GPIO Specifications Unless otherwise noted, Table 13 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and -40 C TA 85 C, 3.0 V to 3.6 V and -40 C TA 85 C, or 2.4 V to 3.0 V and -40 C TA 85 C, respectively. Typical parameters apply to 5 V, 3.3 V, and 2.7 V at 25 C. These are for design guidance only. Table 13. 5-V and 3.3-V DC GPIO Specifications
Symbol RPU VOH1 VOH2 VOH3 VOH4 VOH5 VOH6 VOH7 VOH8 Description Pull-up resistor High output voltage Port 0, 2, or 3 pins High output voltage Port 0, 2, or 3 pins High output voltage Port 1 pins with LDO regulator disabled High output voltage Port 1 pins with LDO regulator disabled High output voltage Port 1 pins with 3.0 V LDO regulator enabled High output voltage Port 1 pins with 3.0 V LDO regulator enabled High output voltage Port 1 pins with 2.4 V LDO regulator enabled High output voltage Port 1 pins with 2.4 V LDO regulator enabled Min 4 VDD - 0.2 VDD - 0.9 VDD - 0.2 VDD - 0.9 2.7 2.2 2.1 2.0 Typ 5.6 - - - - 3.0 - 2.4 - Max 8 - - - - 3.3 - 2.7 - Units k V V V V V V V V Notes IOH 10 A, VDD 3.0 V, maximum of 20 mA source current in all I/Os. IOH = 1 mA, VDD 3.0 V, maximum of 20 mA source current in all I/Os. IOH < 10 A, VDD 3.0 V, maximum of 10 mA source current in all I/Os. IOH = 5 mA, VDD 3.0 V, maximum of 20 mA source current in all I/Os. IOH < 10 A, VDD 3.1 V, maximum of 4 I/Os all sourcing 5 mA. IOH = 5 mA, VDD 3.1 V, maximum of 20 mA source current in all I/Os. IOH < 10 A, VDD 3.0 V , maximum of 20 mA source current in all I/Os. IOH < 200 A, VDD 3.0 V, maximum of 20 mA source current in all I/Os.
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Table 13. 5-V and 3.3-V DC GPIO Specifications
Symbol VOH9 Description High output voltage Port 1 pins with 1.8 V LDO regulator enabled Min 1.6 Typ 1.8 Max 2.0 Units V Notes IOH < 10 A 3.0V VDD 3.6 V 0 C TA 85 C Maximum of 20 mA source current in all I/Os. IOH < 100 A. 3.0V VDD 3.6 V. 0 C TA 85 C. Maximum of 20 mA source current in all I/Os. IOL = 20 mA, VDD > 3.0 V, maximum of 60 mA sink current on even port pins (for example, P0[2] and P1[4]) and 60 mA sink current on odd port pins (for example, P0[3] and P1[5]). VOH = VDD - 0.9. See the limitations of the total current in the Notes for VOH. VOH = VDD - 0.9, for the limitations of the total current and IOH at other VOH levels, see the Notes for VOH. VOH = VDD - 0.9, for the limitations of the total current and IOH at other VOH levels, see the Notes for VOH. VOL = 0.75 V, see the limitations of the total current in the Notes for VOL 3.6 V VDD 5.25 V 3.6 V VDD 5.25 V Gross tested to 1 A Package and pin dependent Temperature = 25 C Package and pin dependent Temperature = 25 C
VOH10
High output voltage Port 1 pins with 1.8 V LDO regulator enabled
1.5
-
-
V
VOL
Low output voltage
-
-
0.75
V
IOH IOH2 IOH4 IOL VIL VIH VH IIL CIN COUT
High level source current High level source current port 0, 2, or 3 pins High level source current port 1 Pins with LDO regulator disabled Low level sink current Input low voltage Input high voltage Input hysteresis voltage Input leakage (absolute value) Capacitive load on pins as input Capacitive load on pins as output
- 1 5 20 - 2.0 - - 0.5 0.5
- - - - - - 140 1 1.7 1.7
20 - - - 0.8 - - - 5 5
mA mA mA mA V V mV nA pF pF
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Table 14. 2.7-V DC GPIO Specifications
Symbol RPU VOH1 VOH2 VOL Description Pull-up resistor High output voltage Port 1 pins with LDO regulator disabled High output voltage Port 1 pins with LDO regulator disabled Low output voltage Min 4 VDD - 0.2 VDD - 0.5 - Typ 5.6 - - - Max 8 - - 0.75 Units k V V V Notes IOH < 10 A, maximum of 10 mA source current in all I/Os. IOH = 2 mA, maximum of 10 mA source current in all I/Os. IOL = 10 mA, maximum of 30 mA sink current on even port pins (for example, P0[2] and P1[4]) and 30 mA sink current on odd port pins (for example, P0[3] and P1[5]). VOH = VDD - 0.5, for the limitations of the total current and IOH at other VOH levels see the notes for VOH. VOH = .75 V, see the limitations of the total current in the note for VOL IOL = 5 mA Maximum of 50 mA sink current on even port pins (for example, P0[2] and P3[4]) and 50 mA sink current on odd port pins (for example, P0[3] and P2[5]). 2.4 V VDD 3.6 V 2.4 V VDD 3.6 V 2.4 V VDD 2.7 V 2.7 V VDD 3.6 V Gross tested to 1 A Package and pin dependent Temperature = 25 C Package and pin dependent Temperature = 25 C
IOH2 IOL VOLP1
High level source current port 1 Pins with LDO regulator disabled Low level sink current Low output voltage port 1 pins
2 10 -
- - -
- - 0.4
mA mA V
VIL VIH1 VIH2 VH IIL CIN COUT
Input low voltage Input high voltage Input high voltage Input hysteresis voltage Input leakage (absolute value) Capacitive load on pins as input Capacitive load on pins as output
- 1.4 1.6 - - 0.5 0.5
- - - 60 1 1.7 1.7
0.75 - - - - 5 5
V V V mV nA pF pF
DC Analog Mux Bus Specifications Table 15 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and -40 C TA 85 C, 3.0 V to 3.6 V and -40 C TA 85 C, or 2.4 V to 3.0 V and -40 C TA 85 C, respectively. Typical parameters apply to 5 V, 3.3 V, or 2.7 V at 25 C. These are for design guidance only. Table 15. DC Analog Mux Bus Specifications
Symbol RSW Description Switch resistance to common analog bus Min - Typ - Max 400 800 Units Notes VDD 2.7 V 2.4 V VDD 2.7 V
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DC POR and LVD Specifications Table 16 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and -40 C TA 85 C, 3.0 V to 3.6 V and -40 C TA 85 C, or 2.4 V to 3.0 V and -40 C TA 85 C, respectively. Typical parameters apply to 5 V, 3.3 V, or 2.7 V at 25 C. These are for design guidance only. Table 16. DC POR and LVD Specifications
Symbol VPPOR0 VPPOR1 VPPOR2 VLVD0 VLVD1 VLVD2 VLVD3 VLVD4 VLVD5 VLVD6 VLVD7 Description VDD value for PPOR trip PORLEV[1:0] = 00b PORLEV[1:0] = 01b PORLEV[1:0] = 10b VDD value for LVD trip VM[2:0] = 000b VM[2:0] = 001b VM[2:0] = 010b VM[2:0] = 011b VM[2:0] = 100b VM[2:0] = 101b VM[2:0] = 110b VM[2:0] = 111b Min - - - 2.39 2.54 2.75 2.85 2.96 - - 4.52 Typ 2.36 2.60 2.82 2.45 2.71 2.92 3.02 3.13 - - 4.73 Max 2.40 2.65 2.95 2.51[3] 2.78[4] 2.99[5] 3.09 3.20 - - 4.83 Units V V V V V V V V V V V Notes VDD is greater than or equal to 2.5 V during startup, reset from the XRES pin, or reset from watchdog.
Notes 3. Always greater than 50 mV above VPPOR (PORLEV = 00) for falling supply. 4. Always greater than 50 mV above VPPOR (PORLEV = 01) for falling supply. 5. Always greater than 50 mV above VPPOR (PORLEV = 10) for falling supply. 6. A maximum of 36 x 50,000 block endurance cycles is allowed. This is balanced between operations on 36 x 1 blocks of 50,000 maximum cycles each, 36 x 2 blocks of 25,000 maximum cycles each, or 36 x 4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36 x 50,000 and that no single block ever sees more than 50,000 cycles). 7. The 50,000 cycle flash endurance per block is only guaranteed if the flash is operating within one voltage range. Voltage ranges are 2.4 V to 3.0 V, 3.0 V to 3.6 V and 4.75 V to 5.25 V.
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DC Programming Specifications Table 17 lists the guaranteed minimum and maximum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and -40 C TA 85 C, 3.0 V to 3.6 V and -40 C TA 85 C, or 2.4 V to 3.0 V and -40 C TA 85 C, respectively. Typical parameters apply to 5 V, 3.3 V, or 2.7 V at 25 C. These are for design guidance only. Flash endurance and retention specifications with the use of the EEPROM User Module are valid only within the range: 25 C +/-20C during the Flash Write operation. Reference the EEPROM User Module datasheet instructions for EEPROM flash write requirements outside of the 25 C +/-20 C temperature window. Table 17. DC Programming Specifications
Symbol VDDP VDDLV VDDHV VDDIWRITE IDDP VILP VIHP IILP IIHP VOLV VOHV FlashENPB FlashENT FlashDR Description VDD for programming and erase Low VDD for verify High VDD for verify Supply voltage for flash write operation Supply current during programming or verify Input low voltage during programming or verify Input high voltage during programming or verify Input current when applying VILP to P1[0] or P1[1] during programming or verify Input current when applying VIHP to P1[0] or P1[1] during programming or verify Output low voltage during programming or verify Output high voltage during programming or verify Flash endurance (per block) Flash endurance (total)[6] Flash data retention Min 4.5 2.4 5.1 2.7 - - 2.2 - - - VDD - 1.0 50,000[7] 1,800,000 10 Typ 5 2.5 5.2 - 5 - - - - - - - - - Max 5.5 2.6 5.3 5.25 25 0.8 - 0.2 1.5 VSS + 0.75 VDD - - - Units Notes V This specification applies to the functional requirements of external programmer tools V This specification applies to the functional requirements of external programmer tools V This specification applies to the functional requirements of external programmer tools V This specification applies to this device when it is executing internal flash writes mA V V mA mA V V - Erase/write cycles per block. - Erase/write cycles. Years Driving internal pull-down resistor. Driving internal pull-down resistor.
DC I2C Specifications Table 18 lists the guaranteed minimum and maximum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and -40 C TA 85 C, 3.0V to 3.6 V and -40 C TA 85 C, or 2.4 V to 3.0 V and -40 C TA 85 C, respectively. Typical parameters apply to 5 V, 3.3 V, or 2.7 V at 25 C. These are for design guidance only. Flash endurance and retention specifications with the use of the EEPROM user module are valid only within the range: 25 C +/-20C during the Flash Write operation. Reference the EEPROM User Module datasheet instructions for EEPROM flash Write requirements outside of the 25 C +/-20 C temperature window. Table 18. DC I2C Specifications[8]
Symbol VILI2C VIHI2C Description Input low level Input high level Min - - 0.7 x VDD Typ - - - Max 0.3 x VDD 0.25 x VDD - Units V V V Notes 2.4 V VDD 3.6 V 4.75 V VDD 5.25 V 2.4 V VDD 5.25 V
Notes 8. All GPIO meet the DC GPIO VIL and VIH specifications found in the DC GPIO Specifications sections. The I2C GPIO pins also meet the above specs. 9. 0 to 70 C ambient, VDD = 3.3 V.
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AC Electrical Characteristics
AC Chip Level Specifications Table 19, Table 20, and Table 21 list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and -40 C TA 85 C, 3.0 V to 3.6 V and -40 C TA 85 C, or 2.4 V to 3.0 V and -40 C TA 85 C respectively. Typical parameters apply to 5 V, 3.3 V, or 2.7 V at 25 C. These are for design guidance only. Table 19. 5-V and 3.3-V AC Chip-Level Specifications
Symbol FCPU1 F32K1 F32K_U Description CPU frequency (3.3 V nominal) Internal low speed oscillator frequency Internal low speed oscillator (ILO) untrimmed frequency Min 0.75 15 5 Typ - 32 - Max 12.6 64 100 Units MHz kHz kHz Notes 12 MHz only for SLIMO Mode = 0. After a reset and before the M8C starts to run, the ILO is not trimmed. See the System Resets section of the PSoC Technical Reference Manual for details on this timing. Trimmed for 3.3 V operation using factory trim values. See Figure 10 on page 17, SLIMO mode = 0. Trimmed for 3.3 V operation using factory trim values. See Figure 10 on page 17, SLIMO mode = 1.
FIMO12
Internal main oscillator stability for 12 MHz (commercial temperature)[9] Internal main oscillator stability for 6 MHz (commercial temperature) Duty cycle of IMO Internal low speed oscillator duty cycle External reset pulse width Time from end of POR to CPU executing code
11.4
12
12.6
MHz
FIMO6
5.5
6.0
6.5
MHz
DCIMO DCILO tXRST tPOWERUP
40 20 10 - - - - -
50 50 - 16 - 200 600 100
60 80 - 100 250 1600 1400 900
% % s ms V/ms ps ps ps
Power-up from 0 V. See the System Resets section of the PSoC Technical Reference Manual.
SRPOWER_UP Power supply slew rate tjit_IMO [11] 12 MHz IMO cycle-to-cycle jitter (RMS) 12 MHz IMO long term N cycle-to-cycle jitter (RMS) 12 MHz IMO period jitter (RMS)
N = 32
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Table 20. 2.7-V AC Chip Level Specifications
Symbol FCPU1 F32K1 F32K_U Description CPU Frequency (2.7 V nominal) Internal low speed oscillator frequency Internal low speed oscillator (ILO) untrimmed frequency Min 0.75 8 5 Typ - 32 - Max 3.25 96 100 Units MHz kHz kHz Notes SLIMO mode = 0 After a reset and before the M8C starts to run, the ILO is not trimmed. See the System Resets section of the PSoC Technical Reference Manual for details on this timing. Trimmed for 2.7 V operation using factory trim values. See Figure 10 on page 17, SLIMO mode = 0. Trimmed for 2.7 V operation using factory trim values. See Figure 10 on page 17, SLIMO mode = 1.
FIMO12
IMO stability for 12 MHz (commercial temperature)[10] IMO stability for 6 MHz (commercial temperature) Duty cycle of IMO Internal low speed oscillator duty cycle External reset pulse width Time from end of POR to CPU executing code Power supply slew rate 12 MHz IMO cycle-to-cycle jitter (RMS) 12 MHz IMO long term N cycle-to-cycle jitter (RMS) 12 MHz IMO period jitter (RMS)
11.0
12
12.9
MHz
FIMO6
5.5
6.0
6.5
MHz
DCIMO DCILO tXRST tPOWERUP SRPOWER_UP tjit_IMO [11]
40 20 10 - - - - -
50 50 - 16 - 500 800 300
60 80 - 100 250 900 1400 500
% % s ms V/ms ps ps ps
Power-up from 0 V. See the System Resets section of the PSoC Technical Reference Manual
N = 32
Notes 10. 0 C to 70 C ambient, VDD = 3.3 V. 11. Refer to Cypress Jitter Specifications Application Note - AN5054 at http://www.cypress.com for more information.
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AC GPIO Specifications Table 21 and Table 22 list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and -40 C TA 85 C, 3.0 V to 3.6 V and -40 C TA 85 C, or 2.4 V to 3.0 V and -40 C TA 85 C respectively. Typical parameters apply to 5 V, 3.3 V, or 2.7 V at 25 C. These are for design guidance only. Table 21. 5-V and 3.3-V AC GPIO Specifications
Symbol FGPIO tRise023 tRise1 tFall Description GPIO operating frequency Rise time, strong mode, Cload = 50 pF ports 0, 2, 3 Rise time, strong mode, Cload = 50 pF port 1 Fall time, strong mode, Cload = 50 pF all ports Min 0 15 10 10 Typ - - - - Max 6 80 50 50 Units MHz ns ns ns Notes Normal strong mode, port 1. VDD = 3.0 to 3.6 V and 4.75 V to 5.25 V, 10% to 90% VDD = 3.0 V to 3.6 V, 10% to 90% VDD = 3.0 V to 3.6 V and 4.75 V to 5.25 V, 10% to 90%
Table 22. 2.7-V AC GPIO Specifications
Symbol FGPIO tRise023 tRise1 tFall Description GPIO operating frequency Rise time, strong mode, Cload = 50 pF ports 0, 2, 3 Rise time, strong mode, Cload = 50 pF port 1 Fall time, strong mode, Cload = 50 pF all Ports Min 0 15 10 10 Typ - - - - Max 1.5 100 70 70 Units MHz ns ns ns Notes Normal strong mode, port 1. VDD = 2.4 V to 3.0 V, 10% to 90% VDD = 2.4 V to 3.0 V, 10% to 90% VDD = 2.4 V to 3.0 V, 10% to 90%
Figure 11. GPIO Timing Diagram
90% GPIO Pin Output Voltage 10%
TRise023 TRise1
TFall
AC Comparator Specifications Table 23 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and -40 C TA 85 C, 3.0 V to 3.6 V and -40 C TA 85 C, or 2.4 V to 3.0 V and -40 C TA 85 C, respectively. Typical parameters apply to 5 V, 3.3 V, or 2.7 V at 25 C. These are for design guidance only. Table 23. AC Comparator Specifications
Symbol tCOMP Description Comparator response time, 50 mV overdrive Min - Typ - Max 100 200 Units ns ns Notes VDD 3.0 V. 2.4 V < VCC <3.0 V.
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AC External Clock Specifications Table 24, Table 25, Table 26, and Table 27 list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and -40 C TA 85 C, 3.0 V to 3.6 V and -40 C TA 85 C, or 2.4 V to 3.0 V and -40 C TA 85 C, respectively. Typical parameters apply to 5 V, 3.3 V, or 2.7 V at 25 C. These are for design guidance only. Table 24. 5-V AC External Clock Specifications
Symbol FOSCEXT - - - Frequency High period Low period Power-up IMO to switch Description Min 0.750 38 38 150 Typ - - - - Max 12.6 5300 - - Units MHz ns ns s Notes
Table 25. 3.3-V AC External Clock Specifications
Symbol FOSCEXT Description Frequency with CPU clock divide by 1 Min 0.750 Typ - Max 12.6 Units MHz Notes Maximum CPU frequency is 12 MHz at 3.3 V. With the CPU clock divider set to 1, the external clock must adhere to the maximum frequency and duty cycle requirements.
- - -
High period with CPU clock divide by 1 Low period with CPU clock divide by 1 Power-up IMO to switch
41.7 41.7 150
- - -
5300 - -
ns ns s
Table 26. 2.7-V (Nominal) AC External Clock Specifications
Symbol FOSCEXT Description Frequency with CPU clock divide by 1 Min 0.750 Typ - Max 3.080 Units MHz Notes Maximum CPU frequency is 3 MHz at 2.7 V. With the CPU clock divider set to 1, the external clock must adhere to the maximum frequency and duty cycle requirements. If the frequency of the external clock is greater than 3 MHz, the CPU clock divider is set to 2 or greater. In this case, the CPU clock divider ensures that the fifty percent duty cycle requirement is met.
FOSCEXT
Frequency with CPU clock divide by 2 or greater
0.15
-
6.35
MHz
- - -
High period with CPU clock divide by 1 Low period with CPU clock divide by 1 Power-up IMO to switch
160 160 150
- - -
5300 - -
ns ns s
Table 27. 2.7-V (Minimum) AC External Clock Specifications
Symbol FOSCEXT Description Frequency with CPU clock divide by 1 Min 0.750 Typ - Max 6.30 Units MHz Notes Maximum CPU frequency is 6 MHz at 2.7 V. With the CPU clock divider set to 1, the external clock must adhere to the maximum frequency and duty cycle requirements. If the frequency of the external clock is greater than 6 MHz, the CPU clock divider is set to 2 or greater. In this case, the CPU clock divider ensures that the fifty percent duty cycle requirement is met.
FOSCEXT
Frequency with CPU clock divide by 2 or greater
0.15
-
12.6
MHz
- - -
High period with CPU clock divide by 1 Low period with CPU clock divide by 1 Power-up IMO to switch
160 160 150
- - -
5300 - -
ns ns s
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AC Programming Specifications Table 28 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and -40 C TA 85 C, 3.0 V to 3.6 V and -40 C TA 85 C, or 2.4 V to 3.0 V and -40 C TA 85 C respectively. Typical parameters apply to 5 V, 3.3 V, or 2.7 V at 25 C. These are for design guidance only. Table 28. AC Programming Specifications
Symbol tRSCLK tFSCLK tSSCLK tHSCLK FSCLK tERASEB tWRITE tDSCLK tDSCLK3 tDSCLK2 tERASEALL tPROGRAM_HOT tPROGRAM_COLD Description Rise time of SCLK Fall time of SCLK Data setup time to falling edge of SCLK Data hold time from falling edge of SCLK Frequency of SCLK Flash erase time (Block) Flash block write time Data out delay from falling edge of SCLK Data out delay from falling edge of SCLK Data out delay from falling edge of SCLK Flash erase time (Bulk) Flash block erase + flash block write time Flash block erase + flash block write time Min 1 1 40 40 0 - - - - - - - - Typ - - - - - 10 40 - - - 20 - - Max 20 20 - - 8 - - 45 50 70 - 100 200 Units ns ns ns ns MHz ms ms ns ns ns ms ms ms Notes
3.6 VDD 3.0 VDD 3.6 2.4 VDD 3.0 Erase all blocks and protection fields at once 0 C Tj 100 C -40 C Tj 0 C
AC I2C Specifications Table 29 and Table 30 list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and -40 C TA 85 C, 3.0 V to 3.6 V and -40 C TA 85 C, or 2.4 V to 3.0 V and -40 C TA 85 C respectively. Typical parameters apply to 5 V, 3.3 V, or 2.7 V at 25 C. These are for design guidance only. Table 29. AC Characteristics of the I2C SDA and SCL Pins for VDD 3.0 V
Symbol FSCLI2C tHDSTAI2C tLOWI2C tHIGHI2C tSUSTAI2C tHDDATI2C tSUDATI2C tSUSTOI2C tBUFI2C tSPI2C SCL clock frequency Hold time (repeated) START condition. After this period, the first clock pulse is generated LOW period of the SCL clock HIGH period of the SCL clock Setup time for a repeated START condition Data hold time Data setup time Setup time for STOP condition Bus free time between a STOP and START condition Pulse width of spikes are suppressed by the input filter Description Standard Mode Min 0 4.0 4.7 4.0 4.7 0 250 4.0 4.7 - Max 100 - - - - - - - - - Fast Mode Min 0 0.6 1.3 0.6 0.6 0 100
[12]
Max 400 - - - - - - - - 50
Units kHz s s s s s ns s s ns
0.6 1.3 0
Note 12. A Fast Mode I2C bus device is used in a Standard Mode I2C bus system but the requirement tSU; DAT 250 ns is met. This automatically is the case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line trmax + tSU; DAT = 1000 + 250 = 1250 ns (according to the Standard Mode I2C bus specification) before the SCL line is released.
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Table 30. 2.7-V AC Characteristics of the I2C SDA and SCL Pins (Fast Mode not Supported)
Symbol FSCLI2C tHDSTAI2C tLOWI2C tHIGHI2C tSUSTAI2C tHDDATI2C tSUDATI2C tSUSTOI2C tBUFI2C tSPI2C SCL clock frequency Hold time (repeated) START condition. After this period, the first clock pulse is generated LOW period of the SCL clock HIGH period of the SCL clock Setup time for a repeated start condition Data hold time Data setup time Setup time for STOP condition Bus free time between a STOP and START condition Pulse width of spikes are suppressed by the input filter Description Standard Mode Min 0 4.0 4.7 4.0 4.7 0 250 4.0 4.7 - Max 100 - - - - - - - - - Fast Mode Min - - - - - - - - - - Max - - - - - - - - - - Units kHz s s s s s ns s s ns
Figure 12. Definition for Timing for Fast/Standard Mode on the I2C Bus
I2C_SDA TSUDATI2C THDSTAI2C I2C_SCL THIGHI2C TLOWI2C S START Condition Sr Repeated START Condition TSUSTOI2C THDDATI2CTSUSTAI2C TSPI2C
TBUFI2C
P
S
STOP Condition
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AC SPI Specifications Table 31 and Table 32 list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and -40 C TA 85 C, 3.0 V to 3.6 V and -40 C TA 85 C, or 2.4 V to 3.0 V and -40 C TA 85 C respectively. Typical parameters apply to 5 V, 3.3 V, or 2.7 V at 25 C. These are for design guidance only. Table 31. SPI Master AC Specifications
Symbol FSCLK DCSCLK tSETUP tHOLD tOUT_VAL tOUT_HIGH Parameter SCLK clock frequency SCLK duty cycle MISO to SCLK setup time SCLK to MISO hold time SCLK to MOSI valid time MOSI high time Conditions - - - - - - Min - - 40 40 - 40 Typ - 50 - - - - Max 12 - - - 40 - Units MHz % ns ns ns ns
Table 32. SPI Slave AC Specifications
Symbol FSCLK tLOW tHIGH tSETUP tHOLD tSS_MISO tSCLK_MISO tSS_HIGH tSS_SCLK tSCLK_SS Parameter SCLK clock frequency SCLK low time SCLK high time MOSI to SCLK setup time SCLK to MOSI hold time SS low to MISO valid SCLK to MISO valid SS high time Time from SS low to first SCLK Time from last SCLK to SS high Conditions - - - - - - - - - - Min - 41.67 41.67 30 50 - - 50 2/FSCLK 2/FSCLK Typ - - - - - - - - - - Max 12 - - - - 153 125 - - - Units MHz ns ns ns ns ns ns ns ns ns
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Packaging Dimensions
This section illustrates the packaging specifications for the CY8C20234, CY8C20334, CY8C20434, CY8C20534, and CY8C20634 PSoC devices along with the thermal impedances for each package. Important Note Emulation tools may require a larger area on the target PCB than the chip's footprint. For a detailed description of the emulation tools' dimensions, refer to the emulator pod drawings at http://www.cypress.com. Figure 13. 8-Pin (150-Mil) SOIC
51-85066 *D
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Figure 14. 16-Pin (150-Mil) SOIC
51-85068 *C
Figure 15. 48-Pin (7 x 7 x 1.0 mm) QFN
001-12919*C
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Figure 16. 16-Pin QFN No E-Pad 3 x 3 x 0.6 mm Package Outline (Sawn)
2.9 3.1
0.20 min 1 2 0.20 DIA TYP.
2.9 3.1
1 1.5 (NOM) 2
0.45 0.55 PIN #1 ID
0.152 REF. 0.05 MAX 0.60 MAX 1.5 SEATING PLANE
0.30 0.18
0.50
TOP VIEW
SIDE VIEW NOTES:
BOTTOM VIEW
PART NO. LG16A LD16A
DESCRIPTION LEAD-FREE STANDARD
1. JEDEC # MO-220 2. Package Weight: 0.014g 3. DIMENSIONS IN MM, MIN MAX
001-09116 *E
Figure 17. 24-Pin (4 x 4 x 0.55 mm) Sawn QFN
001-13937 *C
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Figure 18. 32-Pin QFN 5 x 5 x 0.55 mm (Sawn)
001-48913 *B
Figure 19. 28-Pin (210-Mil) SSOP
51-85079 *D
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Figure 20. 30-Ball (1.85 x 2.31 x 0.40 mm) WLCSP
001-44613 *A
Important Note For information on the preferred dimensions for mounting the QFN packages, see the application note "Application Notes for Surface Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages" available at http://www.amkor.com. It is important to note that pinned vias for thermal conduction are not required for the low power 24, 32, and 48-pin QFN PSoC devices.
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Thermal Impedances
Table 33 illustrates the minimum solder reflow peak temperature to achieve good solderability. Table 33. Thermal Impedances Per Package
Package 8 SOIC 16 SOIC 16 QFN 24 QFN[14] 28 SSOP 30 WLCSP 32 QFN[14] 48 QFN[14] Typical JA [13] 127 C/W 80 C/W 46 C/W 25 C/W 96 C/W 54 C/W 27 C/W 28 C/W
Solder Reflow Peak Temperature
Table 34 illustrates the minimum solder reflow peak temperature to achieve good solderability. Table 34. Solder Reflow Peak Temperature
Package 8-Pin SOIC 16-Pin SOIC 16-Pin QFN 24-Pin QFN 28-Pin SSOP 30-Pin WLCSP 32-Pin QFN 48-Pin QFN Maximum Peak Temperature 260 C 260 C 260 C 260 C 260 C 260 C 260 C 260 C Time at Maximum Temperature 20 s 20 s 20 s 20 s 20 s 20 s 20 s 20 s
Notes 13. TJ = TA + Power x JA. 14. To achieve the thermal impedance specified for the QFN package, refer to "Application Notes for Surface Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages" available at http://www.cypress.com. 15. Higher temperatures is required based on the solder melting point. Typical temperatures for solder are 220 5 C with Sn-Pb or 245 5 C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.
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Development Tool Selection
Software
PSoC DesignerTM At the core of the PSoC development software suite is PSoC Designer, used to generate PSoC firmware applications. PSoC Designer is available free of charge at http://www.cypress.com and includes a free C compiler. PSoC Programmer PSoC Programmer is flexible enough and is used on the bench in development and also suitable for factory programming. PSoC Programmer works either as a standalone programming application or operates directly from PSoC Designer. PSoC Programmer software is compatible with both PSoC ICE Cube In-Circuit Emulator and PSoC MiniProg. PSoC programmer is available free of charge at http://www.cypress.com.
Evaluation Tools
All evaluation tools are sold at the Cypress Online Store. CY3210-MiniProg1 The CY3210-MiniProg1 kit enables the user to program PSoC devices via the MiniProg1 programming unit. The MiniProg is a small, compact prototyping programmer that connects to the PC via a provided USB 2.0 cable. The kit includes:

MiniProg Programming Unit MiniEval Socket Programming and Evaluation Board 28-Pin CY8C29466-24PXI PDIP PSoC Device Sample 28-Pin CY8C27443-24PXI PDIP PSoC Device Sample PSoC Designer Software CD Getting Started Guide USB 2.0 Cable
Development Kits
All development kits are sold at the Cypress Online Store. CY3215-DK Basic Development Kit The CY3215-DK is for prototyping and development with PSoC Designer. This kit supports in-circuit emulation and the software interface enables users to run, halt, and single step the processor and view the content of specific memory locations. PSoC Designer supports the advance emulation features also. The kit includes:

CY3210-PSoCEval1 The CY3210-PSoCEval1 kit features an evaluation board and the MiniProg1 programming unit. The evaluation board includes an LCD module, potentiometer, LEDs, and plenty of breadboarding space to meet all of your evaluation needs. The kit includes:

Evaluation Board with LCD Module MiniProg Programming Unit 28-Pin CY8C29466-24PXI PDIP PSoC Device Sample (2) PSoC Designer Software CD Getting Started Guide USB 2.0 Cable
PSoC Designer Software CD ICE-Cube In-Circuit Emulator ICE Flex-Pod for CY8C29x66 Family Cat-5 Adapter Mini-Eval Programming Board 110 ~ 240V Power Supply, Euro-Plug Adapter iMAGEcraft C Compiler (Registration Required) ISSP Cable USB 2.0 Cable and Blue Cat-5 Cable 2 CY8C29466-24PXI 28-PDIP Chip Samples
CY3214-PSoCEvalUSB The CY3214-PSoCEvalUSB evaluation kit features a development board for the CY8C24794-24LFXI PSoC device. Special features of the board include both USB and capacitive sensing development and debugging support. This evaluation board also includes an LCD module, potentiometer, LEDs, an enunciator and plenty of bread boarding space to meet all of your evaluation needs. The kit includes:

PSoCEvalUSB Board LCD Module MIniProg Programming Unit Mini USB Cable PSoC Designer and Example Projects CD Getting Started Guide Wire Pack
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Device Programmers
All device programmers are purchased from the Cypress Online Store. CY3216 Modular Programmer The CY3216 Modular Programmer kit features a modular programmer and the MiniProg1 programming unit. The modular programmer includes three programming module cards and supports multiple Cypress products. The kit includes:

CY3207ISSP In-System Serial Programmer (ISSP) The CY3207ISSP is a production programmer. It includes protection circuitry and an industrial case that is more robust than the MiniProg in a production programming environment. Note that CY3207ISSP needs special software and is not compatible with PSoC Programmer. The kit includes:

CY3207 Programmer Unit PSoC ISSP Software CD 110 ~ 240V Power Supply, Euro-Plug Adapter USB 2.0 Cable
Modular Programmer Base 3 Programming Module Cards MiniProg Programming Unit PSoC Designer Software CD Getting Started Guide USB 2.0 Cable
Accessories (Emulation and Programming)
Table 35. Emulation and Programming Accessories
Part Number CY8C20234-12LKXI CY8C20334-12LQXI CY8C20634-12FDXI Pin Package 16 QFN 24 QFN 30 WLCSP Flex-Pod Kit [16] Not Available CY3250-20334QFN Foot Kit [17] CY3250-16QFN-FK CY3250-24QFN-FK Not Available Prototyping Module Adapter [18]
CY3210-20X34 Not Available CY3210-20X34 AS-24-28-01ML-6 CY3210-20X34 Not Available
Notes 16. Dual function Digital I/O Pins also connect to the common analog mux. 17. This part may be used for in-circuit debugging. It is NOT available for production. 18. Programming adapter converts non-DIP package to DIP footprint. Specific details and ordering information for each of the adapters is available at http://www.emulation.com.
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Ordering Information
Table 36 lists the CY8C20234, CY8C20334, CY8C20434, CY8C20534, and CY8C20634 PSoC device's key package features and ordering codes. Table 36. PSoC Device Key Features and Ordering Information
Ordering Code CY8C20134-12SXI CY8C20234-12SXI CY8C20534-12PVXI CY8C20534-12PVXIT CY8C20000-12LFXI CY8C20234-12LKXI CY8C20234-12LKXIT CY8C20334-12LQXI CY8C20334-12LQXIT CY8C20434-12LQXI CY8C20434-12LQXIT Package 8-Pin SOIC 16-Pin SOIC 28-Pin SSOP 28-Pin SSOP 48-Pin OCD QFN[16] 16-Pin (3 x 3 mm 0.60 Max) Sawn QFN 16-Pin (3 x 3 mm 0.60 Max) Sawn QFN (Tape and Reel) 24-Pin (4 x 4 mm 0.60 Max) Sawn QFN 24-Pin (4 x 4 mm 0.60 Max) Sawn QFN (Tape and Reel) 32-Pin (5 x 5 mm 0.60 Max) Thin Sawn QFN 32-Pin (5 x 5 mm 0.60 Max) Thin Sawn QFN (Tape and Reel) 30-Ball WLCSP 30-Ball WLCSP (Tape and Reel) Flash (Bytes) 8K 8K 8K 8K 8K 8K 8K 8K 8K 8K 8K SRAM (Bytes) 512 512 512 512 512 512 512 512 512 512 512 Digital CapSense- Digital Blocks Blocks I/O Pins 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 6 13 24 24 28 13 13 20 20 28 28 Analog Inputs 6 13 24[16] 24[16] 28[16] 13
[16]
Analog XRES Outputs Pin 0 0 0 0 0 0 0 0 0 0 0 No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
13[16] 20[16] 20[16] 28 28
CY8C20634-12FDXI CY8C20634-12FDXIT
8K 8K
512 512
0 0
1 1
27 27
27 27
0 0
Yes Yes
Note For Die sales information, contact a local Cypress sales office or Field Applications Engineer (FAE).
Ordering Code Definitions
CY 8 C 20 xxx- 12 xx Package Type: Thermal Rating: PX = PDIP Pb-Free C = Commercial SX = SOIC Pb-Free I = Industrial PVX = SSOP Pb-Free E = Extended LFX/LKX/LQX = QFN Pb-Free AX = TQFP Pb-Free FDX = WLCSP Pb-free Speed: 12 MHz Part Number Family Code Technology Code: C = CMOS Marketing Code: 8 = Cypress PSoC Company ID: CY = Cypress
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Acronyms
Acronyms Used
Table 37 lists the acronyms that are used in this document. Table 37. Acronyms Used in this Datasheet
Acronym AC ADC API CMOS CPU EEPROM GPIO ICE IDAC IDE ILO IMO I/O ISSP LCD LDO LED LVD MCU light-emitting diode low voltage detect microcontroller unit alternating current analog-to-digital converter application programming interface complementary metal oxide semiconductor central processing unit electrically erasable programmable read-only memory general purpose I/O in-circuit emulator current DAC integrated development environment internal low speed oscillator internal main oscillator input/output in-system serial programming liquid crystal display Description Acronym MIPS OCD PCB PGA POR PPOR PSoC(R) PWM QFN SLIMO SPITM SRAM SROM SSOP USB WDT WLCSP XRES on-chip debug printed circuit board programmable gain amplifier power on reset precision power on reset Programmable System-on-Chip pulse width modulator quad flat no leads slow IMO serial peripheral interface static random access memory supervisory read only memory shrink small-outline package universal serial bus watchdog timer wafer level chip scale package external reset Description million instructions per second
Reference Documents
PSoC(R) CY8C20x34 and PSoC(R) CY8C20x24 Technical Reference Manual (TRM) - 001-13033 Design Aids - Reading and Writing PSoC(R) Flash - AN2015 (001-40459) Adjusting PSoC(R) Trims for 3.3 V and 2.7 V Operation - AN2012 (001-17397) Understanding Datasheet Jitter Specifications for Cypress Timing Products - AN5054 (001-14503) Application Notes for Surface Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages - available at http://www.amkor.com.
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Document Conventions
Units of Measure
Table 38 lists the unit sof measures. Table 38. Units of Measure
Symbol C pF kHz MHz k A mA nA s picofarad kilohertz megahertz kilohm ohm microampere milliampere nanoampere microsecond Unit of Measure degree Celsius Symbol ms ns ps V mV V W mm % millisecond nanosecond picosecond microvolts millivolts volts watt millimeter percent Unit of Measure
Numeric Conventions
Hexadecimal numbers are represented with all letters in uppercase with an appended lowercase `h' (for example, `14h' or `3Ah'). Hexadecimal numbers may also be represented by a `0x' prefix, the C coding convention. Binary numbers have an appended lowercase `b' (for example, 01010100b' or `01000011b'). Numbers not indicated by an `h' or `b' are decimals.
Glossary
active high 1. A logic signal having its asserted state as the logic 1 state. 2. A logic signal having the logic 1 state as the higher voltage of the two states. The basic programmable opamp circuits. These are SC (switched capacitor) and CT (continuous time) blocks. These blocks can be interconnected to provide ADCs, DACs, multi-pole filters, gain stages, and much more. A device that changes an analog signal to a digital signal of corresponding magnitude. Typically, an ADC converts a voltage to a digital number. The digital-to-analog (DAC) converter performs the reverse operation. A series of software routines that comprise an interface between a computer application and lower level services and functions (for example, user modules and libraries). APIs serve as building blocks for programmers that create software applications. A signal whose data is acknowledged or acted upon immediately, irrespective of any clock signal. A stable voltage reference design that matches the positive temperature coefficient of VT with the negative temperature coefficient of VBE, to produce a zero temperature coefficient (ideally) reference. 1. The frequency range of a message or information processing system measured in hertz. 2. The width of the spectral region over which an amplifier (or absorber) has substantial gain (or loss); it is sometimes represented more specifically as, for example, full width at half maximum. 1. A systematic deviation of a value from a reference value. 2. The amount by which the average of a set of values departs from a reference value. 3. The electrical, mechanical, magnetic, or other force (field) applied to a device to establish a reference level to operate the device. Page 40 of 47
analog blocks
analog-to-digital (ADC)
Application programming interface (API) asynchronous Bandgap reference
bandwidth
bias
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Glossary
block 1. A functional unit that performs a single function, such as an oscillator. 2. A functional unit that may be configured to perform one of several functions, such as a digital PSoC block or an analog PSoC block. 1. A storage area for data that is used to compensate for a speed difference, when transferring data from one device to another. Usually refers to an area reserved for IO operations, into which data is read, or from which data is written. 2. A portion of memory set aside to store data, often before it is sent to an external device or as it is received from an external device. 3. An amplifier used to lower the output impedance of a system. 1. A named connection of nets. Bundling nets together in a bus makes it easier to route nets with similar routing patterns. 2. A set of signals performing a common function and carrying similar data. Typically represented using vector notation; for example, address[7:0]. 3. One or more conductors that serve as a common connection for a group of related devices. The device that generates a periodic signal with a fixed frequency and duty cycle. A clock is sometimes used to synchronize different logic blocks. An electronic circuit that produces an output voltage or current whenever two input levels simultaneously satisfy predetermined amplitude requirements. A program that translates a high level language, such as C, into machine language. In PSoC devices, the register space accessed when the XIO bit, in the CPU_F register, is set to `1'. An oscillator in which the frequency is controlled by a piezoelectric crystal. Typically a piezoelectric crystal is less sensitive to ambient temperature than other circuit components.
buffer
bus
clock
comparator
compiler configuration space crystal oscillator
cyclic redundancy A calculation used to detect errors in data communications, typically performed using a linear check (CRC) feedback shift register. Similar calculations may be used for a variety of other purposes such as data compression. data bus A bi-directional set of signals used by a computer to convey information from a memory location to the central processing unit and vice versa. More generally, a set of signals used to convey data between digital functions. A hardware and software system that allows you to analyze the operation of the system under development. A debugger usually allows the developer to step through the firmware one step at a time, set break points, and analyze memory. A period of time when neither of two or more signals are in their active state or in transition. The 8-bit logic blocks that can act as a counter, timer, serial receiver, serial transmitter, CRC generator, pseudo-random number generator, or SPI. A device that changes a digital signal to an analog signal of corresponding magnitude. The analogto-digital (ADC) converter performs the reverse operation. The relationship of a clock period high time to its low time, expressed as a percent.
debugger
dead band digital blocks
digital-to-analog (DAC) duty cycle
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Glossary
emulator Duplicates (provides an emulation of) the functions of one system with a different system, so that the second system appears to behave like the first system. An active high signal that is driven into the PSoC device. It causes all operation of the CPU and blocks to stop and return to a pre-defined state. An electrically programmable and erasable, non-volatile technology that provides you the programmability and data storage of EPROMs, plus in-system erasability. Non-volatile means that the data is retained when power is OFF. The smallest amount of Flash ROM space that may be programmed at one time and the smallest amount of Flash space that may be protected. A Flash block holds 64 bytes. The number of cycles or events per unit of time, for a periodic function. The ratio of output current, voltage, or power to input current, voltage, or power, respectively. Gain is usually expressed in dB. A two-wire serial computer bus by Philips Semiconductors (now NXP Semiconductors). I2C is an Inter-Integrated Circuit. It is used to connect low-speed peripherals in an embedded system. The original system was created in the early 1980s as a battery control interface, but it was later used as a simple internal bus system for building control electronics. I2C uses only two bi-directional pins, clock and data, both running at +5V and pulled high with resistors. The bus operates at 100 kbits/second in standard mode and 400 kbits/second in fast mode. The in-circuit emulator that allows you to test the project in a hardware environment, while viewing the debugging device activity in a software environment (PSoC Designer).
External Reset (XRES) Flash
Flash block
frequency gain I2C
ICE
input/output (I/O) A device that introduces data into or extracts data from a system. interrupt A suspension of a process, such as the execution of a computer program, caused by an event external to that process, and performed in such a way that the process can be resumed. A block of code that normal code execution is diverted to when the M8C receives a hardware interrupt. Many interrupt sources may each exist with its own priority and individual ISR code block. Each ISR code block ends with the RETI instruction, returning the device to the point in the program where it left normal program execution. 1. A misplacement of the timing of a transition from its ideal position. A typical form of corruption that occurs on serial data streams. 2. The abrupt and unwanted variations of one or more signal characteristics, such as the interval between successive pulses, the amplitude of successive cycles, or the frequency or phase of successive cycles.
interrupt service routine (ISR)
jitter
low-voltage detect A circuit that senses VDD and provides an interrupt to the system when VDD falls lower than a selected threshold. (LVD) M8C An 8-bit Harvard-architecture microprocessor. The microprocessor coordinates all activity inside a PSoC by interfacing to the Flash, SRAM, and register space. A device that controls the timing for data exchanges between two devices. Or when devices are cascaded in width, the master device is the one that controls the timing for data exchanges between the cascaded devices and an external interface. The controlled device is called the slave device.
master device
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Glossary
microcontroller An integrated circuit chip that is designed primarily for control systems and products. In addition to a CPU, a microcontroller typically includes memory, timing circuits, and IO circuitry. The reason for this is to permit the realization of a controller with a minimal quantity of chips, thus achieving maximal possible miniaturization. This in turn, reduces the volume and the cost of the controller. The microcontroller is normally not used for general-purpose computation as is a microprocessor. The reference to a circuit containing both analog and digital techniques and components. A device that imposes a signal on a carrier. 1. A disturbance that affects a signal and that may distort the information carried by the signal. 2. The random variations of one or more characteristics of any entity such as voltage, current, or data. A circuit that may be crystal controlled and is used to generate a clock frequency. A technique for testing transmitting data. Typically, a binary digit is added to the data to make the sum of all the digits of the binary data either always even (even parity) or always odd (odd parity). An electronic circuit that controls an oscillator so that it maintains a constant phase angle relative to a reference signal. The pin number assignment: the relation between the logical inputs and outputs of the PSoC device and their physical counterparts in the printed circuit board (PCB) package. Pinouts involve pin numbers as a link between schematic and PCB design (both being computer generated files) and may also involve pin names. A group of pins, usually eight. A circuit that forces the PSoC device to reset when the voltage is lower than a pre-set level. This is a type of hardware reset. Cypress Semiconductor's PSoC(R) is a registered trademark and Programmable System-onChipTM is a trademark of Cypress.
mixed-signal modulator noise
oscillator parity
Phase-locked loop (PLL) pinouts
port Power on reset (POR) PSoC(R)
PSoC DesignerTM The software for Cypress' Programmable System-on-Chip technology. pulse width An output in the form of duty cycle which varies as a function of the applied measurand modulator (PWM) RAM An acronym for random access memory. A data-storage device from which data can be read out and new data can be written in. A storage device with a specific capacity, such as a bit or byte. A means of bringing a system back to a know state. See hardware reset and software reset. An acronym for read only memory. A data-storage device from which data can be read out, but new data cannot be written in. 1. Pertaining to a process in which all events occur one after the other. 2. Pertaining to the sequential or consecutive occurrence of two or more related activities in a single device or channel.
register reset ROM
serial
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Glossary
settling time The time it takes for an output signal or value to stabilize after the input has changed from one value to another. A memory storage device that sequentially shifts a word either left or right to output a stream of serial data. A device that allows another device to control the timing for data exchanges between two devices. Or when devices are cascaded in width, the slave device is the one that allows another device to control the timing of data exchanges between the cascaded devices and an external interface. The controlling device is called the master device. An acronym for static random access memory. A memory device where you can store and retrieve data at a high rate of speed. The term static is used because, after a value is loaded into an SRAM cell, it remains unchanged until it is explicitly altered or until power is removed from the device. An acronym for supervisory read only memory. The SROM holds code that is used to boot the device, calibrate circuitry, and perform Flash operations. The functions of the SROM may be accessed in normal user code, operating from Flash. A signal following a character or block that prepares the receiving device to receive the next character or block. 1. A signal whose data is not acknowledged or acted upon until the next active edge of a clock signal. 2. A system whose operation is synchronized by a clock signal. A function whose output can adopt three states: 0, 1, and Z (high-impedance). The function does not drive any value in the Z state and, in many respects, may be considered to be disconnected from the rest of the circuit, allowing another output to drive the same net. A UART or universal asynchronous receiver-transmitter translates between parallel bits of data and serial bits. Pre-build, pre-tested hardware/firmware peripheral functions that take care of managing and configuring the lower level Analog and Digital PSoC Blocks. User Modules also provide high level API (Application Programming Interface) for the peripheral function. The bank 0 space of the register map. The registers in this bank are more likely to be modified during normal program execution and not just during initialization. Registers in bank 1 are most likely to be modified only during the initialization phase of the program. A name for a power net meaning "voltage drain." The most positive power supply signal. Usually 5 V or 3.3 V. A name for a power net meaning "voltage source." The most negative power supply signal. A timer that must be serviced periodically. If it is not serviced, the CPU resets after a specified period of time.
shift register
slave device
SRAM
SROM
stop bit
synchronous
tri-state
UART
user modules
user space
VDD VSS watchdog timer
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Document History Page
Document Title: CY8C20134, CY8C20234, CY8C20334, CY8C20434, CY8C20534, CY8C20634 PSoC(R) Programmable System-on-ChipTM Document Number: 001-05356 Revision ** *A ECN 404571 418513 Orig. of Change HMT HMT Submission Date See ECN See ECN Description of Change New silicon and document (Revision **). Updated Electrical Specifications, including Storage Temperature and Maximum Input Clock Frequency. Updated Features and Analog System Overview. Modified 32-pin QFN E-PAD dimensions. Added new 32-pin QFN. Add High Output Drive indicator to all P1[x] pinouts. Updated trademarks. Made datasheet "Final". Added new Development Tool section. Added OCD pinout and package diagram. Added 16-pin QFN. Updated 24-pin and 32-pin QFN package diagrams to 0.60 max thickness. Changed from commercial to industrial temperature range. Updated Storage Temperature specification and notes. Updated thermal resistance data. Added development tool kit part numbers. Finetuned features and electrical specifications. Added CapSense SNR requirement reference. Added Low Power Comparator (LPC) AC/DC electrical specifications tables. Added 2.7V minimum specifications. Updated figure standards. Updated Technical Training paragraph. Added QFN package clarifications and dimensions. Updated ECN-ed Amkor dimensioned QFN package diagram revisions. Updated 24-pin QFN Theta JA. Added External Reset Pulse Width, TXRST, specification. Fixed 48-pin QFN.vsd. Updated the table introduction and high output voltage description in section two. The sentence: "Exceeding maximum ratings may shorten the battery life of the device." does not apply to all datasheets. Therefore, the word "battery" is changed to "useful." Took out tabs after table and figure numbers in titles and added two hard spaces. Updated the section, DC GPIO Specifications on page 18 with new text. Updated VOH5 and VOH6 to say, "High Output Voltage, Port 1 Pins with 3.0V LDO Regulator Enabled." Updated VOH7 and VOH8 with the text, "maximum of 20 mA source current in all I/Os."Added 28-pin SSOP part, pinout, package. Updated specs. Modified dev. tool part numbers. Added 32-pin Sawn QFN Pin diagram Removed package diagram: 32-Pin (5 x 5 mm) SAWN QFN(001-42168 *A) Updated Ordering Information table with CY8C20434-12LQXI and CY8C20434-12LQXIT ordering details. Corrected Table 16. DC Programming Specifications - Included above the table "Flash Endurance and Retention specifications with the use of the EEPROM User Module are valid only within the range: 25 C +/-20C during the Flash Write operation. Refer the EEPROM User Module datasheet instructions for EEPROM Flash Write requirements outside of the 25 C +/-20 C temperature window." Corrected Ordering Information format. Updated package diagrams 001-13937 and 001-30999. Updated datasheet template. Corrected Figure 6 (28-pin diagram). Updated VOH5, VOH7, and VOH9 specifications Changed title from PSoC(R) Mixed Signal Array to PSoC(R) Programmable System-on-ChipTM Replaced package outline drawing for 32-Pin Sawn QFN Updated "Development Tool Selection" on page 36 Updated "Development Tools" on page 5 and "Designing with PSoC Designer" on page 6 Updated "Getting Started" on page 4 Updated AC Chip-Level, and AC Programming Specifications as follows: Modified FIMO6 (page 20), TWRITE specifications (page 23) Added IOH, IOL (page 17), Flash endurance note (page 19), DCILO (page 20), F32K_U (page 20), TPOWERUP (page 20), TERASEALL (page 23), TPROGRAM_HOT (page 24), and TPROGRAM_COLD (page 24) specifications Added AC SPI Master and Slave Specifications Added 30-Ball WLCSP Package
*B
490071
HMT
See ECN
*C
788177
HMT
See ECN
*D
1356805 HMT/SFVTM P3/HCL/SFV
See ECN
*E
2197347
UVS/AESA
See ECN
*F *G *H
2542938 RLRM/AESA 2610469 2693024 SNV/PYRS DPT/PYRS
07/30/2008 11/20/08 04/16/2009
*I
2717566 DRSW/AESA
06/11/2009
Document Number: 001-05356 Rev. *N
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Document History Page
Document Title: CY8C20134, CY8C20234, CY8C20334, CY8C20434, CY8C20534, CY8C20634 PSoC(R) Programmable System-on-ChipTM Document Number: 001-05356 Revision *J ECN 2825336 Orig. of Change ISW Submission Date 12/10/2009 Description of Change Updated pin description table for 48-pin OCD. Updated Ordering information table to include CY8C20534-12PVXA parts. Updated package diagrams for 48-pin QFN, 16-pin QFN (sawn), 24-pin QFN (sawn), and 30-ball WLCSP specs. Updated Programmable pin configuration details in Features. Updated Analog Multiplexer System. Updated Cypress website links. Updated PSoC Designer Software Subsystems. Added TBAKETEMP and TBAKETIME parameters in Absolute Maximum Ratings. Removed the following sections: DC Low Power Comparator Specifications, AC Analog Mux Bus Specifications, AC Low Power Comparator Specifications, Third Party Tools, and Build a PSoC Emulator into your Board. Modified Notes in Packaging Dimensions. Updated Ordering Code Definitions. Removed inactive parts from Ordering Information. Updated links in Sales, Solutions, and Legal Information. Added part number CY8C20134 to the title. Added 8-pin and 16-pin SOIC pin and package details. Updated content to match current style guide and datasheet template. Moved acronyms and units of measure tables to page 35. Added PSoC Device Characteristics table . Added DC I2C Specifications table. Added F32K_U max limit. Added Tjit_IMO specification, removed existing jitter specifications. Updated Units of Measure, Acronyms, Glossary, and References sections. Updated solder reflow specifications. No specific changed were made to I2C Timing Diagram. Updated for clearer understanding. Template and styles update. CY8C20134-12SX1I and CY8C20234-12SX2I typo error fixed in the ordering information table and changed in to CY8C20134-12SXI and CY8C20234-12SXI. Updated document version and date. Updated package diagram to 001-12919 *C.
*K
2892629
NJF
03/15/2010
*L
2872902
VMAD
04/06/10
*M
3043170
NJF
09/30/10
*N
3173718
NJF
02/16/2011
Document Number: 001-05356 Rev. *N
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Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives, and distributors. To find the office closest to you, visit us at Cypress Locations.
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(c) Cypress Semiconductor Corporation, 2005-2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress' product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement.
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